Products

2 Layers ENIG

2 Layers Carbon OSP

6 Layers Impedance

4 Layers HAL-LF

4 Layers Carbon OSP

2 Layers Immersion Tin

6 Layers ENIG

4 Layers ENIG

2 Layers Red

6 Layers BGA

8 Layers Blind via

10 Layers HDI

2 Layers Blue

4 Layers Bonding
Capabilities
Capabilities | Standard Production | Develop |
---|---|---|
Layer Count | 1 ~ 20 | 28 |
Materials | Halogen / CEM-3 / FR-4 / Aluminium | Lower Dk / Df |
Glass Transition Temperature | Tg130 ℃ / Tg140 ℃ / Tg150 ℃ / Tg170 ℃ | Tg200 ℃ |
PCB Thickness | 0.2 ~ 3.2mm | 0.1 ~ 4.8mm |
Copper Thickness | 18μm / 35μm / 70μm / 105μm / 140μm | 210μm / 280μm |
PTH Copper Thickness | 20μm / 25μm | |
Min. Line / Spacing | 0.10mm / 0.10mm | 0.075mm / 0.075mm |
Smallest Hole Size | 0.20mm | 0.15mm |
Soldermask Color | Blue / Red / White / Black / Green / Yellow | |
Max. PCB Size | 546mm x 622mm | 600mm x 1000mm |
Surface Finishing | HAL-Lead-Free / OSP / Immersion Gold / Immersion Tin / Immersion Silver | |
Scoring | Yes | Yes |
Peelable Mask / Carbon Print | Yes | YeS |
HDI | 2+N+2 / 3+N+3 | 4+N+4 / 5+N+5 |
Impedance Controlled | + /- 10% | + /- 5% |
PTH Hole Size Tolerance | 0.076mm | 0.05mm |
Warpage | Max. 0.75% | Max. 0.50% |
Process Flow

PCB standard


