Products

2 Layers ENIG

2 Layers Carbon OSP

6 Layers Impedance

4 Layers HAL-LF

4 Layers Carbon OSP

2 Layers Immersion Tin

6 Layers ENIG

4 Layers ENIG

2 Layers Red

6 Layers BGA

8 Layers Blind via

10 Layers HDI

2 Layers Blue

4 Layers Bonding

Capabilities

CapabilitiesStandard ProductionDevelop
Layer Count1 ~ 2028
MaterialsHalogen / CEM-3 / FR-4 / AluminiumLower Dk / Df
Glass Transition TemperatureTg130 ℃ / Tg140 ℃ / Tg150 ℃ / Tg170 ℃Tg200 ℃
PCB Thickness0.2 ~ 3.2mm0.1 ~ 4.8mm
Copper Thickness18μm / 35μm / 70μm / 105μm / 140μm210μm / 280μm
PTH Copper Thickness20μm / 25μm
Min. Line / Spacing0.10mm / 0.10mm0.075mm / 0.075mm
Smallest Hole Size0.20mm0.15mm
Soldermask ColorBlue / Red / White / Black / Green / Yellow
Max. PCB Size546mm x 622mm600mm x 1000mm
Surface FinishingHAL-Lead-Free / OSP / Immersion Gold / Immersion Tin / Immersion Silver
ScoringYesYes
Peelable Mask / Carbon PrintYesYeS
HDI2+N+2 / 3+N+34+N+4 / 5+N+5
Impedance Controlled + /- 10% + /- 5%
PTH Hole Size Tolerance 0.076mm0.05mm
WarpageMax. 0.75%Max. 0.50%

Process Flow

PCB standard